SESGLICOPEEL S 100 ML - PH 2.5
SESGLICOPEEL S 100 ML - PH 2.5
Chemical peel for oily and/or acné prone skins (hormonal), hyperkeratotic conditions (psoriasis, seborrheic dermatitis), and acne scars. (NOT AVAILABLE IN USA).
Glycolic acid (GA) is one of the most commonly used chemical substances in superficial peels.
It is highly water-soluble and contains small molecules. These qualities grant it an increased transepidermal penetration capacity which might occasionally cause, slight irritation after application. This AHA causes a number of total or partial changes in the epidermis and the papillary dermis.
The procedure generates skin alterations by stimulating epidermal proliferation through the removal of specific layers of altered skin or the induction of tissue inflammatory reactions which are not yet properly understood.
After several applications of this type of peel, skin changes may be observed, such as new collagen deposits and an increase of GAGs in the papillary dermis, which contribute to the repair of photodamaged skin.
- Apply Sesglicopeel using a gauze, starting from the least sensitive areas in the skin and moving toward the most sensitive ones (forehead, cheeks, submandibular region, chin, upper lip, and nose).
- Allow to act for 5 to 10 minutes or until the treatment endpoint is reached: mild redness without flaking. Once the time is over, in order to stop the peel from acting and penetrating deeper into the skin neutralize it by washing the affected area with plenty of water. After rinsing, to ensure a complete neutralization of the peel, a coat of neutralizing lotion may be applied.
- After application, monitor any areas that are warmer to the touch and any erythema and properly neutralize.
- If there are more than three affected areas, the whole area of the peel should be neutralized.
- During application, it is normal for patients to feel a slight tingling sensation on the skin. This will subside after a few minutes.
- 20% Lactic acid.
- 15% Glycolic acid.
- 10% Salicylic acid
- 5% Citric acid.